Effect of diode laser-assisted bleaching on the bond strength of different adhesive systems to enamel: Interfacial SEM analysis

dc.contributor.authorCevval Ozkocak, Begum Busra
dc.contributor.authorAytac Bal, Fatma
dc.date.accessioned2024-03-13T10:30:39Z
dc.date.available2024-03-13T10:30:39Z
dc.date.issued2021
dc.departmentİstanbul Beykent Üniversitesien_US
dc.description.abstractThe aim of this study was to investigate the effectiveness of diode laser-assisted bleaching on the shear bond strength (SBS) of different adhesive systems to enamel and examine the adhesive enamel interface under scanning electron microscope (SEM). 180 incisor teeth were randomly divided into three bleaching groups: (1) Unbleached control group, (2) Opalescence Boost (OB) 40%, and (3) Diode laser-assisted LaserWhite20 (LW20) 45%. After bleaching, each group was divided into two subgroups according to waiting time: immediately or 7 days' delay. The six groups were then divided into three subgroups based on the adhesive procedure: Single Bond 2 (SB2), Clearfil SE Bond (CSB), and Clearfil Universal Bond (CUB). After adhesive procedures, composite resin cylinders were bonded to the enamel surfaces. All specimens were subjected to a SBS test after 24 hr of storage in water. Data were analysed using three-way variance analysis (p < .05). Specimens were examined under a stereomicroscope and SEM. There was a significant difference between the groups bonded immediately and 7 days after bleaching (p < .05). SB2 after 7 days showed the highest SBS values (19.24 +/- 2.18), whereas CUB showed the lowest values in both bleaching treatments and control groups (10.84 +/- 1.66). SEM analysis of the unbleached specimens revealed long tags and uniform hybrid layer compared OB and LW20 bleaching groups. LW20 and OB bleaching adversely affected SBS to enamel when bonded immediately. Diode laser-assisted bleaching might be an alternative option due to the short working time but delaying bonding for 7 days after bleaching may not be enough for ideal adhesion.en_US
dc.identifier.doi10.1002/jemt.23711
dc.identifier.endpage1552en_US
dc.identifier.issn1059-910X
dc.identifier.issn1097-0029
dc.identifier.issue7en_US
dc.identifier.pmid33511727en_US
dc.identifier.scopus2-s2.0-85099807010en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage1542en_US
dc.identifier.urihttps://doi.org/10.1002/jemt.23711
dc.identifier.urihttps://hdl.handle.net/20.500.12662/3453
dc.identifier.volume84en_US
dc.identifier.wosWOS:000612681400001en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.indekslendigikaynakPubMeden_US
dc.language.isoenen_US
dc.publisherWileyen_US
dc.relation.ispartofMicroscopy Research And Techniqueen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectbond strengthen_US
dc.subjectdiode laseren_US
dc.subjectenamelen_US
dc.subjectpower bleachingen_US
dc.subjectuniversal adhesiveen_US
dc.titleEffect of diode laser-assisted bleaching on the bond strength of different adhesive systems to enamel: Interfacial SEM analysisen_US
dc.typeArticleen_US

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