Effect of diode laser-assisted bleaching on the bond strength of different adhesive systems to enamel: Interfacial SEM analysis

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The aim of this study was to investigate the effectiveness of diode laser-assisted bleaching on the shear bond strength (SBS) of different adhesive systems to enamel and examine the adhesive enamel interface under scanning electron microscope (SEM). 180 incisor teeth were randomly divided into three bleaching groups: (1) Unbleached control group, (2) Opalescence Boost (OB) 40%, and (3) Diode laser-assisted LaserWhite20 (LW20) 45%. After bleaching, each group was divided into two subgroups according to waiting time: immediately or 7 days' delay. The six groups were then divided into three subgroups based on the adhesive procedure: Single Bond 2 (SB2), Clearfil SE Bond (CSB), and Clearfil Universal Bond (CUB). After adhesive procedures, composite resin cylinders were bonded to the enamel surfaces. All specimens were subjected to a SBS test after 24 hr of storage in water. Data were analysed using three-way variance analysis (p < .05). Specimens were examined under a stereomicroscope and SEM. There was a significant difference between the groups bonded immediately and 7 days after bleaching (p < .05). SB2 after 7 days showed the highest SBS values (19.24 +/- 2.18), whereas CUB showed the lowest values in both bleaching treatments and control groups (10.84 +/- 1.66). SEM analysis of the unbleached specimens revealed long tags and uniform hybrid layer compared OB and LW20 bleaching groups. LW20 and OB bleaching adversely affected SBS to enamel when bonded immediately. Diode laser-assisted bleaching might be an alternative option due to the short working time but delaying bonding for 7 days after bleaching may not be enough for ideal adhesion.


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bond strength, diode laser, enamel, power bleaching, universal adhesive


Microscopy Research And Technique

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